Methods for die-to-wafer device layer transfer with precise control of device layer vertical position
US12310146B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Jan 26, 2022 |
| Grant date | May 20, 2025 |
| Priority date | — |
| Expiry date | May 5, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/142
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and structures are described to facilitate the transfer of device layer coupons with controlled vertical position. In an embodiment, a plurality of device layer coupons is bonded to a receiving substrate with an adhesive layer, where distance between front surfaces of the plurality of device layer coupons and a bulk layer of the receiving substrate is controlled by a plurality of rigid mechanical spacers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.