Methods and devices for introducing separation lines into transparent brittle fracturing materials

US12311469B2 · kind B2 · utility

Assignee

• Schott AG · DE

Inventors

• Andreas Ortner · Gau-Algesheim, DE
• Clemens Kunisch · Armsheim, DE
• Frank-Thomas Lentes · Bingen, DE
• Jens Ulrich Thomas · Mainz, DE
• Kurt Nattermann · Ockenheim, DE
• Michael Kluge · Ludwigshafen, DE

Key dates

• Filing date: Aug 17, 2020
• Grant date: May 27, 2025
• Expiry date: Nov 2, 2040

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P40/57
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method for preparing a workpiece for separation is provided that includes providing a workpiece that is transparent for light of a pulsed laser beam, splitting the laser beam into two partial beams using an optical system, directing both partial beams onto the workpiece, and moving the workpiece and the partial beams relative to one another. The partial beams are directed onto the workpiece incident at different angles to the normal of the irradiated surface and superimposed inside the workpiece such that the partial beams interfere with one another to form a sequence of intensity maxima inside the workpiece. The intensity at the intensity maxima is sufficiently high to modify the material of the workpiece so that a chain-like periodic pattern of material modifications is formed along a path defining a separation line.