Touchless package
US12312142B2 · kind B2 · utility
0Cited by
48References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2022 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Mar 14, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D2075/362
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A package (100), including a base (150) having at least one receptacle (151), in which the at least one receptacle (151) includes a first portion (154) having a first diameter (D1) and a second portion (152) having a bottom surface and a second diameter (D2) is disclosed. A method for removing a product from the package is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.