Patent · US Active

Touchless package

US12312142B2 · kind B2 · utility

0Cited by
48References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 24, 2022
Grant dateMay 27, 2025
Priority date
Expiry dateMar 14, 2042

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB65D2075/362
  • WIPO fieldHandling
  • WIPO sectorMechanical engineering

Abstract

A package (100), including a base (150) having at least one receptacle (151), in which the at least one receptacle (151) includes a first portion (154) having a first diameter (D1) and a second portion (152) having a bottom surface and a second diameter (D2) is disclosed. A method for removing a product from the package is also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.