Patent · US Active

Polyamide molding composition for high-gloss applications

US12312467B2 · kind B2 · utility

0Cited by

9References

7Claims

0Family size

Assignee

BASF SE

Inventors

Rainer Xalter · Basel, CH
Torsten Erdmann · Bad Blankenburg, DE
Xaver Hopfenspirger · Nümbrecht, DE
Stefan Milimonka · Ludwigshafen, DE

Key dates

Filing date	Mar 4, 2020
Grant date	May 27, 2025
Priority date	—
Expiry date	Dec 5, 2041

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2205/02
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Described herein is a thermoplastic molding material including

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.