Thermally reworkable adhesives for electronic devices
US12312504B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2020 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Jan 9, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermally reworkable adhesive includes at least one di-epoxide, at least one diamine that is reactive with the at least one di-epoxide, at least one additive that is miscible, but not reactive, with the at least one di-epoxide and/or the at least one diamine. Reaction of the at least one di-epoxide and the at least one diamine forms a crosslinked polymer network and the at least one additive offsets the stoichiometry of the crosslinked polymer network by 5-50%. The offset crosslinked polymer network forms the thermally reworkable adhesive that once cured, at a temperature in the range of 20-200° C., can be de-bonded from a device to which it is attached at a temperature in the range of 50-200° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.