Material for hot stamping and method of manufacturing the same
US12312652B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2023 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Feb 28, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D2211/008
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Provided are a material for hot stamping, wherein the material includes: a steel sheet including carbon (C) in an amount of 0.19 wt % to 0.25 wt %, silicon (Si) in an amount of 0.1 wt % to 0.6 wt %, manganese (Mn) in an amount of 0.8 wt % to 1.6 wt %, phosphorus (P) in an amount less than or equal to 0.03 wt %, sulfur (S) in an amount less than or equal to 0.015 wt %, chromium (Cr) in an amount of 0.1 wt % to 0.6 wt %, boron (B) in an amount of 0.001 wt % to 0.005 wt %, an additive in an amount less than or equal to 0.1 wt %, balance iron (Fe), and other inevitable impurities; and fine precipitates distributed within the steel sheet. The additive includes at least one of titanium (Ti), niobium (Nb), and vanadium (V), and the fine precipitates include nitride or carbide of at least one of titanium (Ti), niobium (Nb), and vanadium (V) and trap hydrogen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.