Semiconductor processing apparatus and semiconductor processing method using the same
US12312690B2 · kind B2 · utility
0Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2022 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | May 10, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67303
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A semiconductor processing apparatus includes an outer tube, an inner tube in the outer tube and providing a process space, and a nozzle between the outer tube and the inner tube. The nozzle provides an internal passage. The inner tube provides a slit. The nozzle provides a plurality of holes. The plurality of holes are vertically spaced apart from each other. The slit vertically extends to expose at least two of the plurality of holes. The internal passage is connected to the process space through the slit and the plurality of holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.