Heat pump
US12313286B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2022 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Aug 4, 2042 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF24F2013/202
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pump includes a housing, a housing opening that is provided in the housing and is in the form of a water drain, at least one heat-pump component that is elastically mounted in the housing, and a transport securing device for fixing the elastically mounted heat-pump component while the housing is being transported. The transport securing device is configured to close the housing opening with the fixing of the elastically mounted heat-pump component released.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.