Patent · US Active

Heat pump

US12313286B2 · kind B2 · utility

0Cited by
0References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 21, 2022
Grant dateMay 27, 2025
Priority date
Expiry dateAug 4, 2042

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF24F2013/202
  • WIPO fieldThermal processes and apparatus
  • WIPO sectorMechanical engineering

Abstract

A heat pump includes a housing, a housing opening that is provided in the housing and is in the form of a water drain, at least one heat-pump component that is elastically mounted in the housing, and a transport securing device for fixing the elastically mounted heat-pump component while the housing is being transported. The transport securing device is configured to close the housing opening with the fixing of the elastically mounted heat-pump component released.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.