Techniques for thermal management within optical subassembly modules
US12313892B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2020 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Apr 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/042
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure is generally directed to techniques for thermal management within optical subassembly modules that include thermally coupling heat-generating components, such as laser assemblies, to a temperature control device, such as a thermoelectric cooler, without the necessity of disposing the heat-generating components within a hermetically-sealed housing. Accordingly, this arrangement provides a thermal communication path that extends from the heat-generating components, through the temperature control device, and ultimately to a heatsink component, such as a sidewall of a transceiver housing, without the thermal communication path extending through a hermetically-sealed housing/cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.