Integrated device package with an integrated heat sink
US12315776B2 · kind B2 · utility
0Cited by
56References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2021 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Jan 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3736
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated device package is disclosed. The integrated device package can include an electronic component package which includes an electronic component. The integrated device package can include a protective material in which the electronic component is at least partially embedded, wherein the electronic component package comprises a first surface and a second surface. The integrated device package can include a heat sink plated on the first surface. The heat sink can include a base portion and a plurality of heat-dissipating projections extending outwardly therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.