Grounding assembly for a semiconductor device
US12315995B2 · kind B2 · utility
0Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2022 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Aug 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q23/00
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A semiconductor device may include an antenna array and a grounding assembly configured to at least partially electrically shield the antenna array. The grounding assembly may include a first grounding layer comprising a first plurality of openings and a second grounding layer comprising a second plurality of openings. The second grounding layer may at least partially occlude the first plurality of openings of the first grounding layer when viewed from above the antenna array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.