Electronic component assembly with thermally conductive structures for image sensors
US12316935B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2024 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Apr 8, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20472
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.