Earphone
US12317025B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2022 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Jun 3, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2430/01
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This application provides an earphone, which can resolve a problem that a strain sensing module in the earphone and for implementing function keys occupies a large space area, thereby implementing the function keys of the earphone through pressing in multiple directions and reducing an overall size of the earphone. The earphone includes a housing and a pressure-strain structure arranged in a cavity formed by the housing. Two end portions of the pressure-strain structure are both in stable contact with an inner wall of the housing. A strain sensor is arranged on the pressure-strain structure. In a case that the housing is squeezed, the pressure-strain structure generates strain, and the strain sensor is configured to sense the strain generated by the pressure-strain structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.