Stack-PCB architecture with embedded vapor chamber
US12317408B2 · kind B2 · utility
0Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2022 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Mar 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2018
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interposer equipped with a heat spreader and a multi-board system for an electronic device that includes an interposer equipped with a heat spreader between at least two boards. In examples, the interposer may include a heat spreader having an active portion and, optionally, a passive portion. In examples, the active portion may include a vapor chamber, heat pipe, or isothermal plate. In examples, the passive portion may thermally couple the active portion to a heat dissipation device such as a heat sink and/or an outer frame of the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.