Heat sink system
US12317456B2 · kind B2 · utility
0Cited by
7References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 6, 2021 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Apr 23, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20218
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system and method for generating a heat sink for circuitry, such as a power module, that facilitates removal of heat from the circuitry. To improve power density of power modules, not only electrical but also thermal optimization may be carried out as the two subsystems closely interact with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.