Systems for a heat exchanger with a biasing bracket and mounting plate
US12317457B2 · kind B2 · utility
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6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 2022 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Jan 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2049
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems are provided for a power electronics cooling assembly. In one example, a system for a power electronics cooling assembly includes: a first cooling plate, a mounting plate, the mounting plate having mounting points to be attached to a housing, an electronic module disposed between the first cooling plate and the mounting plate, and a spring bracket applying force towards the first cooling plate, the spring bracket having mounting points aligned with the mounting points of the mounting plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.