Method of forming a device structure

US12317609B2 · kind B2 · utility

Assignee

• LONGI GREEN ENERGY TECHNOLOGY CO., LTD. · CN

Inventors

• Ning Song · Cupertino, US
• Yang Li · Nanhu, CN
• Alison Joan Lennon · Sydney, AU
• Pei-Chieh Hsiao · Fawn Drive, AU
• Zi Ouyang · Sydney, AU
• Charles Aram Mandela Hall · Sydney, AU
• Carolin Roemer · Sydney, AU
• Zhimeng Wang · 东风镇, CN

Key dates

• Filing date: May 1, 2020
• Grant date: May 27, 2025
• Expiry date: Jan 28, 2042

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/50

Abstract

This relates to a method of forming a device structure, including: providing at least one device component having front and rear device component surfaces and at least one electrically conductive region on the device component surfaces; providing at least one contact sheet including a polymeric material and at least one electrically conductive element with a non-circular cross-sectional shape and embedded in the polymeric material such that a surface portion of the electrically conductive element is exposed; applying a bonding material to one or both of the exposed surface portion and the electrically conductive regions on the device component surfaces; positioning the contact sheet relative to the device component such that the bonding material is located between the electrically conductive region and the exposed surface portion; activating the bonding material such that a bond and an electrically conductive coupling are formed between the electrically conductive region and the exposed surface portion.