Sensor packages with wavelength-specific light filters
US12317638B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2021 |
| Grant date | May 27, 2025 |
| Priority date | — |
| Expiry date | Jan 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In examples, a sensor package comprises a die pad and a semiconductor die on the die pad. The semiconductor die has an active surface. The sensor package includes a light sensor on the active surface of the semiconductor die. The sensor package includes a mold compound covering the die pad, the semiconductor die, and a portion of the active surface. The sensor package includes a light filter covering the light sensor and abutting the mold compound. The light filter includes a combination of silicone, metal particles, and an organic dye. The combination is configured to reject light having a wavelength in a target wavelength range. The light filter has a thickness of at least 0.5 millimeters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.