Processability of polymeric substrates and related methods
US12318512B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 19, 2021 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Mar 12, 2044 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61L2420/02
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The invention discloses a method for adhering a metal layer to a polymer substrate and device manufacture therefrom. The metal layer is deposited on a sacrificial substrate of a mold to form part of an interior surface of the mold, and a solution of monomers is deposited on the metal layer. The monomers are then polymerized together to form the polymer substrate on the metal layer. Then the polymer substrate is removed from the mold such that the metal layer is removed from the mold and adhered to the polymer substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.