Patent · US Active

Method for microwelding flexible thin films, for example for use in electrical and electronic devices

US12318864B2 · kind B2 · utility

0Cited by

2References

21Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Andreas Heider · Munich, DE
Axel Bormann · Bamberg, DE
Gerhard Kunz · Heiligenhaus, DE
Johannes Proell · Bamberg, DE
Lukas Alter · Stuttgart, DE

Key dates

Filing date	Sep 29, 2020
Grant date	Jun 3, 2025
Priority date	—
Expiry date	Apr 3, 2042

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/12
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for welding a flexible film (10) to a carrier component (20) having the following steps:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.