Polishing apparatus and polishing method
US12318888B2 · kind B2 · utility
0Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2022 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Aug 2, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/004
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus is configured to polish a peripheral edge of an object. The apparatus includes: a stage having a mounting surface to mount the object; a polishing head configured to press a polishing surface against the peripheral edge and polish the peripheral edge; a first inlet configured to supply liquid to the polishing surface; and a protector having a first surface extending along a first direction intersecting with the mounting surface, the first surface having an opening between the stage and the polishing head in a second direction intersecting with the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.