Inductively heated mold system
US12318967B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2023 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Dec 15, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C33/38
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An inductively heated mold system enables rapid heating of the mold and rapid cooling to reduce thermal cycling times by employing an inductive coil in a heater module that inductively heats a ferromagnetic layer configured on the mold body, such as around the outside perimeter of the mold body. A cooling channel may be configured between the inductive coil and the ferromagnetic layer on the mold body to allow a fluid to be passed between the mold body and the heater module to rapidly cool the mold body for removal of the molded part. A plurality of heater modules may be employed that can be coupled together such that the cooling fluid passes through the coupled cooling channels from one module to a second module. In this way heater modules can be combined to provide an inductively heated mold system for a variety of mold body sizes, or lengths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.