Polishing compositions and methods of using the same

US12319843B2 · kind B2 · utility

Assignee

• Fujifilm Electronic Materials U.S.A., Inc. · US

Inventors

• Qingmin Cheng · Mesa, US
• Bin Hu · Mesa, US
• Yannan Liang · Gilbert, US
• Hyosang Lee · Seojong-myeon, KR
• Liqing Wen · Mesa, US
• Yibin Zhang · Gilbert, US
• Abhudaya Mishra · Gilbert, US

Key dates

• Filing date: May 22, 2024
• Grant date: Jun 3, 2025
• Expiry date: May 22, 2044

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/3212
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

This disclosure relates to polishing compositions that include (1) at least one abrasive; (2) at least one organic acid or a salt thereof; (3) at least one first amine compound, the at least one first amine compound including an alkylamine having a 6-24 carbon alkyl chain; (4) at least one second amine compound containing at least two nitrogen atoms, the second amine compound being different from the first amine compound; and (5) an aqueous solvent.