Patent · US Active

Solid polymeric adhesive compositions having high use temperature, and articles and methods thereof

US12319848B2 · kind B2 · utility

0Cited by
17References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 20, 2021
Grant dateJun 3, 2025
Priority date
Expiry dateAug 20, 2041

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J2463/00
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The teachings herein are directed at solid polymeric adhesive compositions for adhering metal components, methods for compounding the polymeric adhesive compositions, articles including a component having the polymeric adhesive composition, methods for producing articles including curing a solid adhesive, and articles including the cured adhesive. Preferred solid polymeric adhesive compositions include a plurality of one or more epoxy resins and one or more polysulfones. In one preferred aspect, the teachings are directed at a stator ring (e.g., for a hybrid motor) including the polymeric adhesive composition for adhering components to a ring.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.