Polyurethane hot melt adhesive for low temperature application
US12319850B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
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Key dates
| Filing date | Apr 15, 2022 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Jun 11, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/306
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a moisture reactive polyurethane hot melt adhesive composition that can be applied to substrates at a low coating weight even at application temperatures as low as 60 to 95° C. while retaining the advantageous high tack, green strength, cured bond strength and toughness of conventional high melting point polyurethane hot melt adhesives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.