Apparatus for optical fiber-to-photonic chip connection and associated methods
US12321022B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 4, 2020 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Aug 29, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4283
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photonic chip includes a substrate, an electrical isolation region formed over the substrate, and a front end of line (FEOL) region formed over the electrical isolation region. The photonic chip also includes an optical coupling region. The electrical isolation region and the FEOL region and a portion of the substrate are removed within the optical coupling region. A top surface of a the substrate within the optical coupling region includes a plurality of grooves configured to receive and align a plurality of optical fibers. The grooves are formed at a vertical depth within the substrate to provide for alignment of optical cores of the plurality of optical fibers with the FEOL region when the plurality of optical fibers are positioned within the plurality of grooves within the optical coupling region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.