Curable resin composition, cured film formed therefrom, and electronic device having cured film
US12321096B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 28, 2020 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Apr 2, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/011
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable resin composition comprising (A) a silicone-based polymer, the surface, and (C) a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.