Wafer processing apparatus and wafer processing method
US12322607B2 · kind B2 · utility
0Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2022 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Nov 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/687
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer processing apparatus of the present invention includes a suction nozzle configured to suction sludge from a cup housing, a flow line connected to the suction nozzle such that the sludge and a chemical solution flow therein, a suction tank connected to the flow line such that the sludge and the chemical solution flow thereto, and an ejector installed on a flow line to generate suction pressure in the suction nozzle and the flow line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.