Heating device and heating method for semiconductor thermal process
US12322612B2 · kind B2 · utility
0Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2022 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Feb 12, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a heating device and heating method for a semiconductor thermal process. The heating device includes: a first heating portion, on which a wafer to-be-heated is placed; a second heating portion, where the first heating portion and the second heating portion are arranged in parallel, and the second heating portion is configured to heat the first heating portion; and an adjustment portion, configured to adjust a vertical distance between the first heating portion and the second heating portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.