Apparatus for transferring electronic component from flexible carrier substrate to flexible target substrate and method of transferring electronic component
US12322630B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2022 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Dec 23, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/687
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for transferring an electronic component from a flexible carrier substrate to a flexible target substrate is provided. The apparatus includes a first frame, a second frame, an abutment element and a deformation generating mechanism. The first frame is used to carry the flexible carrier substrate. The second frame is used to carry the flexible target substrate. The abutment element is arranged adjacent to the first frame, and is controlled by a braking mechanism, and move repeatedly toward and away from the second frame. The deformation generating mechanism is adjacent to the second frame and arranged opposite to the abutment element. When the abutment element moves toward the second frame, the deformation generating mechanism forms a relative force toward the abutment element at a position where the surface of the flexible target substrate carried by the second frame is relative to the abutment element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.