Substrate integrated with passive devices and manufacturing method thereof
US12322669B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 23, 2021 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Apr 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/60
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate integrated with passive devices and a manufacturing method thereof are provided. The manufacturing method of the substrate integrated with passive devices includes: providing a transparent dielectric layer with first connection vias therein, wherein the transparent dielectric layer includes a first surface and a second surface, which are opposite to each other along a thickness direction of the transparent dielectric layer; integrating the passive devices onto the transparent dielectric layer, wherein the passive devices include at least an inductor, the integrating the passive devices onto the transparent dielectric layer includes: forming first sub-structures on the first surface of the transparent dielectric layer, forming second sub-structures on the second surface, and forming first connection electrodes in the first connection vias, respectively; wherein the first sub-structures, the first connection electrodes and the second sub-structures are connected together to form a coil structure of the inductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.