Baffles for electronic circuits immersed in cooling fluid in a tank
US12322676B1 · kind B1 · utility
0Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2024 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Dec 3, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10522
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Examples of devices for providing cooling solutions are described. One example device at least one printed circuit board (PCB) and at least one baffle cover positioned along an edge of the at least one PCB. The at least one PCB is immersed in a cooling fluid in a tank. The at least one PCB includes one or more integrated circuit (IC) chips with a thermal interface material (TIM) applied to surfaces of the one or more IC chips that are coupled to a boilerplate. The baffle cover includes one or more openings that are configured to control an agitation of the cooling fluid proximate to the edge of the at least one PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.