Micro-electro-mechanical system structure
US12323753B2 · kind B2 · utility
0Cited by
18References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2022 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Jul 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes a ventilation hole, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a protrusion extending into the air gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.