Housing of electronic device with different bonded metals and method of manufacturing the same
US12324115B2 · kind B2 · utility
0Cited by
1References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 23, 2022 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Feb 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/0283
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A housing of an electronic device includes two or more metal portions, each having an oxide film layer formed on a surface thereof, and a non-conductive portion formed to cover at least a portion of the oxide film layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.