Manifold systems, devices, and methods for thermal management of hardware components
US12324131B2 · kind B2 · utility
0Cited by
18References
15Claims
0Family size
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Key dates
| Filing date | May 17, 2023 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Nov 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems, devices and methods for providing cooling to hardware components, and more specifically to manifold systems, devices and methods for thermal management of hardware in computer server racks and related equipment in computer data centers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.