Light-emitting device
US12324286B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2024 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Apr 1, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/851
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting device includes a lead frame, a light-emitting diode (LED) chip, and an encapsulant. The LED chip is disposed on the lead frame, and includes a substrate, a semiconductor light-emitting unit disposed on a surface of the substrate, and a first electrode and a second electrode, which are disposed on the surface of the substrate, and which are located outwardly of the semiconductor light-emitting unit. The first and second electrodes are electrically connected to a lower surface of the semiconductor light-emitting unit, and are respectively connected to a first wiring bonding region and a second wiring bonding region on the lead frame. The encapsulant encapsulates the LED chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.