Method of manufacturing semiconductor structure and semiconductor structure
US12324359B2 · kind B2 · utility
0Cited by
5References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 6, 2022 |
| Grant date | Jun 3, 2025 |
| Priority date | — |
| Expiry date | Jul 14, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N50/10
Abstract
The present disclosure provides a method of manufacturing a semiconductor structure and a semiconductor structure. The method of manufacturing a semiconductor structure includes: providing a substrate; forming bottom contact structures in the substrate; forming a storage unit on each of the bottom contact structures; and forming shielding structures that each wrap around one of the storage units, wherein the shielding structures each include multiple dielectric layers and shielding layers arranged alternately.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.