Intra-cardiac echocardiography interposer
US12324701B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Aug 30, 2022 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Oct 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48157
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An imaging catheter assembly is provided. The imaging catheter assembly includes an interposer including a multi-layered substrate structure, wherein the multi-layered substrate structure includes a first plurality of conductive contact pads coupled to a second plurality of conductive contact pads via a plurality of conductive lines; an imaging component coupled to the interposer via the first plurality of conductive contact pads; and an electrical cable coupled to the interposer via the second plurality of conductive contact pads and in communication with the imaging component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.