Patent · US Active

Laser ablation method for engraving a workpiece with a texture

US12325086B2 · kind B2 · utility

0Cited by
1References
10Claims
0Family size

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Key dates

Filing dateNov 16, 2021
Grant dateJun 10, 2025
Priority date
Expiry dateMar 2, 2044

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB23K26/362
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A laser ablation method for engraving a workpiece with a texture by a laser beam emitted by a laser head integrated in a machine tool comprising:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.