Laser ablation method for engraving a workpiece with a texture
US12325086B2 · kind B2 · utility
0Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2021 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Mar 2, 2044 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/362
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser ablation method for engraving a workpiece with a texture by a laser beam emitted by a laser head integrated in a machine tool comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.