Gas control system and method for a reflow soldering furnace
US12325089B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2019 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Aug 23, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present application relates to a gas control system and method for a reflow soldering furnace, comprising: an oxygen detecting device, capable of coming into contact with a gas in a furnace chamber, for detecting an oxygen concentration in the furnace chamber; an intake valve device, for controllably establishing fluid communication between a working gas source and the furnace chamber, thereby inputting the working gas into the furnace chamber; and a controller, for controlling the opening extent of at least one intake valve device based on an oxygen concentration signal, thereby regulating a flow rate of the working gas inputted into the furnace chamber. With a gas control system and method according to the present application, an oxygen concentration in a furnace chamber is detected in real time, and a gas control valve is automatically regulated on the basis of a predetermined set value or target value to control input of a working gas, achieving precise control and fast regulation; in addition, when work is stopped or during work intermissions, a gas control valve can be closed in a timely manner, thereby preventing waste and reducing costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.