Die set apparatus
US12325147B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2021 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Jan 25, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21D37/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lift mechanism of a die set apparatus includes a guide pin, a linear motion guide member, a first washer, a second washer, a first coil spring, and a second coil spring. A first positioning portion and a second positioning portion control a first end turn portion and a second end turn portion from moving in a radial direction of the guide pin in a state where a first gap is formed between the first coil spring and the guide pin. A third positioning portion and a fourth positioning portion control a third end turn portion and a fourth end turn portion from moving in the radial direction of the guide pin in a state where a second gap is formed between the second coil spring and the guide pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.