Nanostructure transfer method
US12325629B2 · kind B2 · utility
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22Claims
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Key dates
| Filing date | Aug 29, 2019 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | May 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/122
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A nanostructure transfer method is provided. The method includes providing a first substrate (10) having thereon a plurality of nanostructures (12), the nanostructures (12) extending away from the first substrate (10). A solder material (14) is deposited on distal ends of the nanostructures (12). A second substrate (18) having thereon a first metal layer (20) is provided. The solder material (14) is bonded to the first metal layer (20), thereby attaching the nanostructures (12) to the second substrate (18). The attached nanostructures (12) are then released from the first substrate (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.