Temperature sensing device
US12326370B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2022 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Mar 7, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.