Probe head and probe assembly
US12326462B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 19, 2023 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Jan 4, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06755
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe head for electrical detection of semiconductor devices and a probe assembly including the same are provided. The probe head includes: a probe head body; and at least one polygon cone shaped contact portion coupled to an end face of the probe head body. The probe head body includes at least three body portions sequentially stacked and coupled axially, the second body portion has an outer diameter greater than the first and third body portions. The at least one contact portion is disposed around the periphery of the end face of the probe head body. Each contact portion has an inclined edge or inclined plane inclined upward and outward from a central portion of the probe head body and oriented to facing a central axis of the probe head body. The first body portion has a hardness greater than or equal to the at least one contact portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.