Mechanically tolerant couplers
US12327164B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 2022 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Feb 24, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/0655
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A modular electronic structure includes a first chip having a first interleaved portion and a first electromagnetic coupler on the first interleaved portion. There is a second chip having a second interleaved portion and a second electromagnetic coupler on the second interleaved portion and configured to electromagnetically couple with the first electromagnetic coupler. The first interleaved portion fits between two surfaces of the second chip. The second interleaved portion fits between two surfaces of the first chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.