Process for making laminate substrate with sintered components
US12327679B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2023 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Dec 14, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/1209
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present disclosure relates to a process to integrate sintered components in a laminate substrate. The disclosed process starts with providing a precursor substrate, which includes a substrate body having an opening through the substrate body, and a first foil layer. Herein, the first foil layer is formed underneath the substrate body, so as to fully cover a bottom of the opening. Next, a sinterable base material is applied into the opening and over the first foil layer, and then sintered at a first sintering temperature to create a sintered base component. A sinterable contact material is applied over the sintered base component, and then sintered at a second sintering temperature to create a sintered contact film. The sintered base component is confined within the opening by the substrate body on sides, by the first foil layer on bottom, and by the sintered contact film on top.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.