Method for adjusting chip mounting position, apparatus, medium, and electronic device
US12327740B2 · kind B2 · utility
0Cited by
5References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 10, 2022 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Nov 17, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for adjusting a chip mounting position, an apparatus, a medium, and an electronic device are provided. The adjustment method includes: obtaining offsets of actual mounting positions of individual chips in a first group of chips; obtaining an average offset for the actual mounting positions of the individual chips in the first group of chips according to the offsets of the actual mounting positions of the individual chips in the first group of chips; and adjusting the chip mounting position according to the average offset for the actual mounting positions of the individual chips in the first group of chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.