Solder pads with concave edges for ball grid arrays
US12328826B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2022 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Jul 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device is provided that includes: a substrate including dielectric material and a conductive via extending into the substrate from a surface of the substrate. The device further includes a conductive pad positioned at the surface of the substrate and offset in a plane of the surface from the conductive via, the conductive pad to receive a solder joint connection to an electronic component. The conductive pad includes a concave edge that defines a gap with a convex edge of the conductive via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.