Protecting method for preventing solder crack failure in electronic product
US12328827B2 · kind B2 · utility
0Cited by
0References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2022 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Jan 1, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2877
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A protecting method for preventing solder crack failure in an electronic product is provided. Firstly, a step (a) is performed to confirm that a crack incidence rate of a metallic solder material in a printed circuit board is high. In a step (b), a protecting mechanism of controlling the electronic product to enter an idle mode and leave the idle mode is activated. Consequently, an operating temperature of the electronic product decreases at a first average drop rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.