Circuit card assemblies
US12328847B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2022 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | Jul 7, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/14
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit card assembly comprising at least one electronic component that generates heat and a thermal management system the at least one electronic component is disclosed. The thermal management system comprises one or more phase change modules for distributing and storing heat; a metal frame in thermal contact with the at least one electronic component and having at least one opening for receiving the one or more phase change modules; and a heat transfer apparatus in thermal contact with one or more of the at least one electronic component and the metal frame. The heat transfer apparatus comprises at least one heat pipe and/or at least one heat spreader. The heat transfer apparatus provides a first heat transfer path during a period of reduced heat dissipation or cooling. The one or more phase change modules distributes and stores heat during the period of reduced heat dissipation or cooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.